the key technologies in commercial markets
Wafer Level Vacuum Package(WLVP) - Low cost, Small
size, Mass production
released the development of Wafer Level
Vacuum Package(WLVP) in 2010. Uelectronics
was the first to establish a mass production
line and then produce thermal image sensors
based on Wafer Level Vacuum Package(WLVP).
MEMS Technology- Sensor design, Manufacturing
technology is a basic technology for the
development and production of thermal imaging
sensors. Uelectronics has 15 years of experience
and know-how in MEMS-based Thermal image
sensors holds multiple the patents protecting
its unique designs, processes and
Technology (α-VWOx) – High sensitive material,
vanadium oxide tungsten (α-VWOx) has the
same TCR value with VOx and also it has
a simple manufacturing process in which
general equipment can be used. So significant
cost savings are possible.
Necessary Skills and Strategies to Penetrate
Multiple IR Sensor Markets
8 inch wafer level vacuum
package reduces manufacturing costs.
Wafer Level Testing can provide wafers to
Uelectronics has developed
partnerships in the supply chain to
IR camera companies which includes major
component manufacturers (IR lens,
Shutter, IR module).
add to Uelectronics’s flexibility and capability
to satisfy all customers’ needs.
cameras have shown strong growth in thermography,
driverless vehicles, security and surveillance
since 2013. Uelectronics has a temperature
algorithm technology that can display temperature
in a thermal image.
: sensing a change in the resistance
: Micro Electro Mechanical System
: Wafer Level Vacuum Package