Broad the applications for next thermal imaging UE S4140 provides high sensitivity and fast response and achieves this with a smaller size and lower cost. The UE S4140 is based on  UelecMEMSTM Micro-bolometer technology. The key to UE S4140’s smaller size and lower cost is Uelectronics’ unique Wafer Level Vacuum Package(WLVP) technology. The result of this advanced production capability is IR sensor arrays with wider applications for the smart thermal imaging. Product feature - Technology : α-VWOX Micro-bolometer - Active array size : 80x80 - Pixel size : 35㎛ - Spectral response : 8~14㎛ - Pixel operability : Over 99.5% - Thermal time constant : <21.19msec - NETD : 150mV/K - Frame Rate : 9Hz~30Hz - Operating temperature : -20℃~60℃ - Package dimension    : PLCC  10.16mm(W) x  10.16mm(H) x 1.775mm(T) - Vacuum integrity : Over 9 years Applications Automotive night vision and detection Visual IR thermometer Concerned area monitoring Personal vision system Smart building/smart home/smart factory  automation(IoT)         - HVAC         - Smart lightning management         - People counting Intruder detection