Broad the applications for next thermal imaging

UE S4140 provides high sensitivity and fast response and achieves this with a smaller size and lower cost.

The UE S4140 is based on  UelecMEMSTM Micro-bolometer technology. The key to UE S4140’s smaller size and lower cost is Uelectronics’ unique Wafer Level Vacuum Package(WLVP) technology. The result of this advanced production capability is IR sensor arrays with wider applications for the smart thermal imaging.

Product feature

- Technology : α-VWOX Micro-bolometer
- Active array size : 80x80
- Pixel size : 35㎛
- Spectral response : 8~14㎛
- Pixel operability : Over 99.5%
- Thermal time constant : <21.19msec
- NETD : 150mV/K
- Frame Rate : 9Hz~30Hz
- Operating temperature : -20℃~60℃
- Package dimension
   : PLCC  10.16mm(W) x  10.16mm(H) x 1.775mm(T)
- Vacuum integrity : Over 9 years


Automotive night vision and detection
Visual IR thermometer
Concerned area monitoring
Personal vision system
Smart building/smart home/smart factory  automation(IoT)
        - HVAC
        - Smart lightning management
        - People counting
Intruder detection