Broad
the applications for next thermal imaging
UE S4140 provides high sensitivity and
fast response and achieves this with a smaller
size and lower cost.
The UE S4140 is based on UelecMEMSTM
Micro-bolometer technology. The key to UE S4140’s
smaller size and lower cost is Uelectronics’
unique Wafer Level Vacuum Package(WLVP)
technology. The result of this advanced
production capability is IR sensor arrays
with wider applications for the smart thermal
imaging.
Product feature
-
Technology
: α-VWOX Micro-bolometer -
Active
array size : 80x80 - Pixel
size : 35㎛ - Spectral response
: 8~14㎛ - Pixel operability
: Over 99.5% - Thermal time
constant : <21.19msec - NETD
: 150mV/K - Frame Rate : 9Hz~30Hz -
Operating
temperature : -20℃~60℃ -
Package
dimension : PLCC 10.16mm(W)
x 10.16mm(H) x 1.775mm(T) -
Vacuum
integrity : Over 9 years
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Applications
Automotive
night vision and detection Visual IR
thermometer Concerned area monitoring Personal
vision system Smart building/smart home/smart
factory automation(IoT) -
HVAC -
Smart lightning management -
People counting Intruder detection
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