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Broad
the applications for next thermal image
and smart detection
UE S3030 provides high sensitivity and
fast response and achieves this with a smaller
size and lower cost.
The UE S3030 is based on UelecMEMSTM
Micro-bolometer technology.
The key to UE S3030’s smaller size and lower
cost is Uelectronics’ unique Wafer Level
Vacuum Process(WLVP) technology. The result
of this advanced production capability is
IR sensor arrays with wider applications
for the smart thermal detection and imaging
Product feature
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-
Technology
: α-VWOX Micro-bolometer
-
Active
array size : 32x32
- Pixel
size : 50㎛
- Spectral response
: 8~14㎛
- Pixel operability
: Over 99.5%
- Thermal time
constant : <29msec
- NETD
: 200mV/K(F/1, 27℃, 9Hz)
-
Frame
Rate : 9Hz
- Operating temperature
: -20℃~60℃
- Package dimension
: PLCC 10.16mm(W) x 10.16mm(H)
x 1.63mm(T)
- Vacuum integrity
: Over 9 years
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Applications
Visual IR thermometer
Concerned
area monitoring
Personal vision system
Smart
building automation(IoT)
-
HVAC
- Smart
lightning management
-
People counting
Home appliances
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