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Products
heatCam
Portable Thermal Imaging Camera
model: UE HC4
Portable Thermal Imaging Camera
for Android Smartphone
Portable Thermal Imaging Camera
for Android Smartphone
Key Feature
  • Mode: Personnel (34℃~42℃), General (-10℃~200℃)
  • Measuring: Area Temp. (2ea) / Spot Temp. (3ea)
  • Temperature Alarm Function
  • Real Image (Smartphone) & Thermal Image in parallel
  • Various Application: Health Care, Leisure and Living in Home, Office, Building and Factory
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Key Feature
  • Mode: Personnel (34℃~42℃), General (-10℃~200℃)
  • Measuring: Area Temp. (2ea) / Spot Temp. (3ea)
  • Temperature Alarm Function
  • Real Image (Smartphone) & Thermal Image in parallel
  • Various Application: Health Care, Leisure and Living in Home, Office, Building and Factory
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Technology
Possess the key technologies in specialized
commercial markets

Infrared

Infrared is the thermal energy that spans a wide wavelength band from 0.76um to 1000um. All objects emit heat energy from the surface, and infrared sensors detect heat energy with or without light. Therefore, infrared thermal imaging allows us to distinguish objects in the dark and to see heat distribution that is not visible to the eye.

Our Tech

Wafer Level Vacuum Package - Small Size, Low Cost, Mass Production

MEMS Technology - MEMS Design and Process Know-how

VWOx - High Sensitivity, Compatible with CMOS process

Wafer Level Image Test

HW/SW and Temperature Algorithm for thermal imaging camera

Read-Out IC

Intellectual Property

Technology
Possess the key technologies in specialized
commercial markets
content
Infrared
Infrared is the thermal energy that spans a wide wavelength band from 0.76um to 1000um. All objects emit heat energy from the surface, and infrared sensors detect heat energy with or without light. Therefore, infrared thermal imaging allows us to distinguish objects in the dark and to see heat distribution that is not visible to the eye.

Our Tech

Wafer Level Vacuum Package - Small Size, Low Cost, Mass Production

MEMS Technology - MEMS Design and Process Know-how

VWOx - High Sensitivity, Compatible with CMOS process

Wafer Level Image Test

HW/SW and Temperature Algorithm for thermal imaging camera

Read-Out IC

Intellectual Property

Competitiveness
Competitiveness
Competitive Strengths of Technology
We have IPs for all manufacturing processes including material, design, process, wafer level vacuum packaging and wafer level image testing of thermal image sensors.
We also provide total solutions of HW/SW and temperature algorithm for the thermal imaging camera applications.
icon

µ-Bolometer type thermal image sensor technology based on VWOx

+ World’s Top 3 thermal image sensors source technologies
+ Strict import and export control due to designation of strategic technology - providing import and export advantage to related companies
+ Possessing our own IPs of sensor materials, structures, and manufacturing technology.
icon

Wafer Level Vacuum
Packaging

+ World’s first announced in 2013 on “Defense & Security” in the U.S.
+ Essential technology for small size, low price, and mass production to meet the consumer market.
+ Consumer market leading through multiple patent registrations in Korea, the U.S.A., EU, Japan, and China.
icon

Wafer Level Image Test

+ World’s first development set-up and holding own IP
+ Introducing WLIT technology from existing CIS image sensors to thermal image sensors for the first time.
+ Test equipment, HW/SW Set-up and test algorithm development.
+ Reducing costs and improving productivity compared to traditional individual testing - mass production.
icon

HW/SW and Temperature Algorithm Solution for thermal imaging camera

+ Possessing own HW/SW and temperature algorithm IP related to thermal imaging camera
+ Non-contact temperature measurement algorithms with a precision of 0.5℃ for personnel mode
icon

Thermal Image Sensor design and process technology based on MEMS technology

+ Design for high-sensitivity thermal image sensor pixels and implementing as array.
+ Independently-developed : technical difficulty is very high and requires many years of know-how.
icon

Read - Out IC

+ Circuit technology for reading signals from pixels of thermal image sensors.
+ Independently-developed : efficient circuit architecture design technology; having know-how
We have IPs for all manufacturing processes including material, design, process, wafer level vacuum packaging and wafer level image testing of thermal image sensors.
We also provide total solutions of HW/SW and temperature algorithm for the thermal imaging camera applications.
Vision
Next Thermal Imaging & Smart Detection
Thermal Image Sensor: Key Essential Sensor of Fourth Industrial Revolution
content
Vision

Next Thermal Imaging & Smart Detection

content
Thermal Image Sensor: Key Essential Sensor of Fourth Industrial Revolution
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Contact Us.
#310, Gyeonggi R&DB Center, 105, Gwanggyo-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, 16229, Rep. of Korea

Phone (+82) 31-888-5601
Fax (+82) 31-888-5600
Email mktg@uelec.co.kr
#310, Gyeonggi R&DB Center, 105, Gwanggyo-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, 16229, Rep. of Korea

Phone (+82) 31-888-5601
Fax (+82) 31-888-5600
Email mktg@uelec.co.kr
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